Conventional PCBs can be any layer count, but rely on conventional drilling and plating technology.
Multilayer up to 68+ layers
Wide range of laminate options including high temperature, low loss and lead-free laminates
Mixed dielectric (hybrid) constructions
Panel size up to 610*1200mm
Embedded coin, or metal core and metal backed MLB
Panel thickness up to 17.5mm
RF and microwave circuits
Heavy copper (12 oz. outer layer / 5 oz. inner layer)
4L Edge Plating For Blind Cavity
4 L Special stack-up
14L HDI Aviation Control board
8L HDI Projector Control board
8L FR408 Communication
Printed Circuit Board (PCB) | Flexible Circuits | Rigid Circuits | MC PCB | PCB Assembly | Components Procurement
※ Communication network
※ Intelligent private network informatization
※ information network
※ Big Data and Cloud Computing
※ Communication，Computing，
※ Industry, Commercial,Instruments,Energy,Consumer electronics
※ Telecommunications
※ Aerospace
※ Industrical Control
※ Medical
※ Automobile
※ Computer & Peripherals
| Items | Mass | Sample | |
| L ayers | 2~64L | 100L | |
| Max. Board Thickness | 10mm ( 394mil) | 14mm ( 551mil) | |
| Min.Inner Layer | Inner Layer | 2.2mil/2.2mil | 2mil/2mil |
| Outer Layer | 3mil/3mil | 2.8mil2.8mil | |
| Registration | Same Core | + 30um | +/-20um |
| Layer to Layer | t5mil | +/-4.5mil | |
| Max. Copper Thickness | 60z | 30Oz | |
| Min. Drill Hole Diameter | Mechanical | 0.15mm(6mi) | 0.1mm(4mil) |
| L aser | 0.1mm(4mi) | 0.075mm(3mil) | |
| Max. Size (Finish Size) | Line-card | 850mmX570mm | 1000mmX600mm |
| Backplane | 1250mmX570mm | 1320mmX600mm | |
| Aspect Ratio (Finish Hole) | Line card | 16:1 | 20:1 |
| Backplane | 22:1 | 25:1 | |
| Material | FR4 | EM827, 370HR, S1000-2, IT180A, EM825, IT158, S1000/ S1155, R1566W, EM285, ,TU862HF | |
| High Speed | Megtron6, Megtron4, Megtron7,TU872SLK, FR408HR,N4000-13 Series, IS680 | ||
| High Frequency | Ro3003, Ro3006, Ro4350B, Ro4450F, Ro4360G2, Ro4835, CLTE, Genclad, RF35 FastRise27,AD255A, 92ML , AD300C, TC600, Diclad880, TC350 | ||
| Others | Polyimide, Tk, LCP, BT, C-ply, Fradflex, Omega, ZBC2000, | ||
| Surface Finish | HASL, ENIG, Immersion Tin, OSP, Immersion Silver, Electroplating Hard Gold/Soft Gold,Gold Finger, Selective OSP, ENEPIG | ||
| ITEMS | Material | |||||||||
| FR4 | EM827 | 370HR | S1000-2 | IT 180A | EM825 | IT158 | S1000 | S1155 | R1566W | TU862HF |
| High Speed | Megtron6 | Megtron4 | Megtron7 | TU872SLK | FR408HR | N4000-13 | F4B-1/2 | F4BK | FF4BM | |
| High Frequency | Ro3003 | Ro3006 | Ro4350B | Ro4360G2 | Ro4835 | CLTE | Genclad | RF35 | FastRise27 | |
| Others | Polyimide | Tk | LCP | BT | C-ply | Fradflex | Omega | ZBC2000 | Taconic | Arion |
