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8L FR408 Communication

Conventional PCBs can be any layer count, but rely on conventional drilling and plating technology.

Multilayer up to 68+ layers

Wide range of laminate options including high temperature, low loss and lead-free laminates

Mixed dielectric (hybrid) constructions

Panel size up to 610*1200mm

Embedded coin, or metal core and metal backed MLB

Panel thickness up to 17.5mm

RF and microwave circuits

Heavy copper (12 oz. outer layer / 5 oz. inner layer)


8L FR408 Communication
We Provide You With A Full Range Of PCB And PCBA One-Stop Service.

Printed Circuit Board (PCB) | Flexible Circuits | Rigid Circuits | MC PCB | PCB Assembly | Components Procurement

For more in depth information on Flex Printed Circuits, click on the links below:
  • Application field
  • Technical ability
  • Material
  • Advanced equipment
  • Reliability

※ Communication network 

※ Intelligent private network informatization

※ information network

※ Big Data and Cloud Computing

※ Communication,Computing,

※ Industry, Commercial,Instruments,Energy,Consumer electronics

※ Telecommunications

※ Aerospace 

※ Industrical Control

※ Medical

※ Automobile

※ Computer & Peripherals

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Items Mass Sample
L ayers 2~64L 100L
Max. Board Thickness 10mm ( 394mil) 14mm ( 551mil)
Min.Inner Layer Inner Layer 2.2mil/2.2mil 2mil/2mil
Outer Layer 3mil/3mil 2.8mil2.8mil
Registration Same Core + 30um +/-20um
Layer to Layer t5mil +/-4.5mil
Max. Copper Thickness 60z 30Oz
Min. Drill Hole Diameter Mechanical 0.15mm(6mi) 0.1mm(4mil)
L aser 0.1mm(4mi) 0.075mm(3mil)
Max. Size (Finish Size) Line-card 850mmX570mm 1000mmX600mm
Backplane 1250mmX570mm 1320mmX600mm
Aspect Ratio (Finish Hole) Line card 16:1 20:1
Backplane 22:1 25:1
Material FR4 EM827, 370HR, S1000-2, IT180A, EM825, IT158, S1000/ S1155, R1566W, EM285, TU862HF
High Speed Megtron6, Megtron4, Megtron7,TU872SLK, FR408HR,N4000-13 Series,  IS680, 
High Frequency Ro3003, Ro3006, Ro4350B, Ro4450F,  Ro4360G2, Ro4835, CLTE, Genclad, RF35 FastRise27,AD255A, 92ML ,  AD300C, TC600, Diclad880, TC350
Others Polyimide, Tk, LCP, BT, C-ply, Fradflex, Omega, ZBC2000,
Surface Finish HASL, ENIG, Immersion Tin, OSP, Immersion Silver, Electroplating Hard Gold/Soft Gold,Gold Finger, Selective OSP, ENEPIG
ITEMS Material 
FR4 EM827 370HR S1000-2 IT 180A EM825 IT158 S1000 S1155 R1566W TU862HF
High Speed Megtron6 Megtron4 Megtron7 TU872SLK FR408HR N4000-13 F4B-1/2 F4BK FF4BM  
High Frequency Ro3003 Ro3006 Ro4350B Ro4360G2 Ro4835 CLTE Genclad RF35 FastRise27  
Others Polyimide Tk LCP BT C-ply Fradflex Omega ZBC2000 Taconic Arion
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