COB (Chip On Board) is not a new packaging technology in semiconductor industry. COB MCPCB applications according to process and material can be categorized into two types: mirro aluminum and silver or gold platting. By using wire bonding & epoxy packaging then directly embedded on MCPCB, this practice can extend the lifespan of LED and unified light emission.
Single Sided LED Aluminum Base PCB
SinkPAD MC PCB
Single Sided COB LED
Single Sided LED Aluminum Base PCB
Single Sided LED Copper Base PCB
Printed Circuit Board (PCB) | Flexible Circuits | Rigid Circuits | MC PCB | PCB Assembly | Components Procurement
※ Indoor Lighting
※ Commercial Lighting
※ Electronic Machinery
※ Automotive Lighting
※ Home Furnishing Lighting
※ Outdoor Lighting
※ Power Supply
| Items | Technical Ability |
| Sheet size | 1250*600mm |
| Maximum layers | 8L |
| Minimum metal base thickness | 0.3mm |
| Maximum metal base thickness | 5.0mm |
| Minimum thermal conductive layer thickness | 0.038mm |
| Thinnest core plate thickness | 0.075mm |
| Thermal conductivity | 1-8W/m.K |
| Breakdown voltage | 6KVAC |
| Minimum inner layer trace width / spacing | 0.075/0.075mm |
| Minimum outer layer trace width / spacing | 0.075/0.075mm |
| Maximum copper thickness | 10 OZ |
| Minimum aluminum based drilling hole diameter | 0.55mm |
| Minimum copper based drilling hole diameter | 0.65mm |
| Contour tolerance | ±0.1mm |
| Special processes | COB, carved cup, copper inlay, pedestal, resin slot ，The thermal separation, SinkPAD |
